Viscoplastic Constitutive Equations for Tin-Lead Eutectic Solder Alloy

Ma Xin, Wang Li, Fang Hongyuan, Qian Yiyu
(National Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology 150001)

£Ábstract: Bodnerª²Partom viscoplastic constitutive theory was used to study the constitutive equations of Sn60-Pb40 eutectic solder alloy. The deformation phenomena asso ciated with the solder's montonic and steady-state creep response were accurately predicted for 10^£­£µ£Ó^£­£±¡Ü¦Å¡Ü£±£°^£­£²£Ó^£­£±¡¡andª«£­£µ£µ¡æ¡Ü£Ô¡Ü£±£²£µ¡æ£®The realistic meaning of using this constitutive equations for life predicting of SMT solder joint under thermomechanical cycle conditions is also discussed.
Keywords: constitutive equation, viscoplastic, Sn60-Pb40 eutectic solder alloy, mathematical simulation.