Life Prediction for Solder Joint Interconnect in the Package—Strain Energy Density Methodology and Effective Strain Methodology
Xu Yangjian,Liu Yong,Liang Lihua,Yu Danming
(College of Mechanical&Electrical Engineering ,Zhejiang University of Technology, Hangzhou 310032,China)

Abstract: Two popular life prediction methodologies—strain energy density metho dology and effective strain methodology, are investigated. The correspondingsol deralloy material constitutive models are compared, and the correlative subrout ines about the above material constitutive model are written in FORTRAN and introduced into ANSYS finite element simulation software. 3D die stacked chipscale ball grid array package model is estalished and simulated under accelerated temperature cycling conditions (40~+125℃), and the solder joint interconnect fatigue life is predicted comparatively.
Keywords: solder joint interconnect, life prediction, strain energy density methodology, effective strain methodology, FEM.